News & Press Releases
Latest updates from Chip Interfaces
2026 - 05 - 22 l EXTOLL and Chip Interfaces introduce the Industry´s first Integrated UCIe IP Solution
May 22, 2026
EXTOLL and Chip Interfaces introduce the Industry´s first Integrated UCIe IP Solution for GlobalFoundries FDX Technology. The offering is customer-ready and integrates EXTOLL´s PHY and Chip Interfaces´ D2D Adapter as a co-verified platform to realize highly efficient end-to-end die-to-die connectivity tailored for mainstream technology nodes.
2025 - 12 - 09 l Silicon Creations and Chip Interfaces Announce Successful Interoperability for JESD204B/C, Interlaken, and CPRI
December 09, 2025
Silicon Creations, a leading provider of high-performance analog and mixed-signal IP today announced the successful validation of interoperability of Chip Interfaces’ JESD204B, JESD204C, Interlaken, and CPRI controllers with its Multi-Protocol SerDes PMA(s).
2025 - 09 - 29 l Chip Interfaces and Prodigy Technovations validate I3C Target at MIPI Plugfest in Poland
September 29, 2025
Chip Interfaces and Prodigy Technovations validate I3C Target at MIPI Plugfest in Poland
2025 - 09 - 03 l Chip Interfaces and Soliton Technologies jointly test their I3C Solution at MIPI Plugfest in Poland
September 03, 2025
Chip Interfaces and Soliton Technologies jointly test their I3C Solution at MIPI Plugfest in Poland
2025 - 08 - 27 l Chip Interfaces, through its JESD204C IP, supports Extoll’s collaboration in the development of Eridan’s next-generation ASIC
August 27, 2025
Chip Interfaces, through its JESD204C IP, supports Extoll’s collaboration in the development of Eridan’s next-generation ASIC.
2025 - 01 - 14 l Chip Interfaces Successfully Completes Interlaken IP Interoperability Test with Cadence 112G Long-Reach PHY
January 14, 2025
Chip Interfaces Successfully Completes Interlaken IP Interoperability Test with Cadence 112G Long-Reach PHY.
2024 - 10 - 16 l Successful tape out of Chip Interfaces' JESD204D IP by a tier 1 semiconductor company
October 16, 2024
Chip Interfaces is pleased to announce that the Industry’s first commercially available JESD204D IP core has been taped out with a Tier 1 semiconductor company.